Infineon Technologies PSB 21382 H V1.3

Mounting Type

Surface Mount

Package / Case

64-QFP

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Series

INCA™

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Voltage - Supply

3.3V 5V

Base Part Number

PSB21382

Function

CODEC

Interface

IOM-2, Parallel, SCI

Number of Circuits

1

Current - Supply

27mA