Infineon Technologies PEB 4265 T V1.2

Mounting Type

Surface Mount

Package / Case

20-SOIC (0.433, 11.00mm Width) Exposed Pad

Supplier Device Package

P-DSO-20-5

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Series

DuSLIC

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Voltage - Supply

5V

Base Part Number

PEB4265

Function

Dual Channel Subscriber Line Interface Circuit (DuSLIC)

Interface

IOM-2, PCM

Number of Circuits

2

Current - Supply

105mA