Infineon Technologies BGH 182M E6327

Mounting Type

Surface Mount

Package / Case

6-XFDFN Exposed Pad

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Published

2007

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Type

Low Pass

Applications

Data Lines for Mobile Devices

Number of Channels

3

ESD Protection

Yes

Filter Order

The order of a filter also indicates the minimum number of reactive components that the filter will require. For example, a third-order filter requires at least three reactive components one capacitor and two inductors, two capacitors and one inductor, or in the case of an active filter, three capacitors.

6th