Infineon Technologies BGB741L7ESDE6327XTSA1

Factory Lead Time

8 Weeks

Contact Plating

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

Tin

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

6-XFDFN Exposed Pad

Number of Pins

6

Usage Level

Military grade

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Published

2009

JESD-609 Code

e4

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Terminal Finish

Gold (Au)

Max Operating Temperature

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

150°C

Min Operating Temperature

-55°C

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

120mW

Voltage - Supply

1.8V~4V

Construction

COMPONENT

Frequency

50MHz~3.5GHz

Test Frequency

a statistical procedure for assessing data that contain counts or the numbers of occurrences of various categories or classes.

1.5GHz

Current - Supply

30mA

Halogen Free

Halogen Free

Gain

19.5dB

RF/Microwave Device Type

WIDE BAND LOW POWER

RF Type

The rate of oscillation of electromagnetic radio waves in the range of 3 kHz to 3 GHz, as well as the alternating currents carrying the radio signals.

Cellular, RKE, WiFi

Input Power-Max (CW)

20dBm

Characteristic Impedance

50Ohm

Max Junction Temperature (Tj)

150°C

Noise Figure

Noise figure (NF) and noise factor (F) are measures of degradation of the signal-to-noise ratio (SNR), caused by components in a signal chain.

1dB

P1dB

-6.5dBm

Height

500μm

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant

Lead Free

Lead Free