Infineon Technologies BGA416E6327HTSA1

Factory Lead Time

6 Weeks

Contact Plating

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

Tin

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

TO-253-4, TO-253AA

Number of Pins

4

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Published

2005

JESD-609 Code

e3

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Max Operating Temperature

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

150°C

Min Operating Temperature

-65°C

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

100mW

Voltage - Supply

2.5V~5V

Construction

COMPONENT

Frequency

100MHz~3GHz

Operating Supply Voltage

The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

3V

Number of Channels

1

Test Frequency

a statistical procedure for assessing data that contain counts or the numbers of occurrences of various categories or classes.

1.8GHz

Power Dissipation

the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

100mW

Current - Supply

5.5mA

Halogen Free

Not Halogen Free

Gain

11dB

RF/Microwave Device Type

WIDE BAND LOW POWER

RF Type

The rate of oscillation of electromagnetic radio waves in the range of 3 kHz to 3 GHz, as well as the alternating currents carrying the radio signals.

Cellular, GSM, CDMA, TDMA, UMTS

Input Power-Max (CW)

8dBm

Characteristic Impedance

50Ohm

Noise Figure

Noise figure (NF) and noise factor (F) are measures of degradation of the signal-to-noise ratio (SNR), caused by components in a signal chain.

1.6dB

P1dB

-3dBm

Height

900μm

Length

2.9mm

Width

1.3mm

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant

Lead Free

Lead Free