Infineon Technologies BCR119SH6327XTSA1

Factory Lead Time

26 Weeks

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

6-VSSOP, SC-88, SOT-363

Number of Pins

6

Collector-Emitter Breakdown Voltage

50V

hFEMin

120

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Published

2007

JESD-609 Code

e3

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Not For New Designs

Moisture Sensitivity Level (MSL)

1 (Unlimited)

ECCN Code

EAR99

Terminal Finish

Tin (Sn)

Max Operating Temperature

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

150°C

Min Operating Temperature

-65°C

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

250mW

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Base Part Number

BCR119S

Polarity

NPN

Element Configuration

The distribution of electrons of an atom or molecule (or other physical structure) in atomic or molecular orbitals.

Dual

Halogen Free

Halogen Free

Transistor Type

2 NPN - Pre-Biased (Dual)

Collector Emitter Voltage (VCEO)

300mV

Max Collector Current

100mA

DC Current Gain (hFE) (Min) @ Ic, Vce

120 @ 5mA 5V

Vce Saturation (Max) @ Ib, Ic

300mV @ 500μA, 10mA

Frequency - Transition

150MHz

Resistor - Base (R1)

4.7k Ω

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant

Lead Free

Lead Free