Infineon LSPK372-PO

Test Current (mA)

50

Maximum Forward Voltage (V)

3.8

Maximum Power Dissipation (mW)

240

Minimum Operating Temperature (°C)

-55

Maximum Operating Temperature (°C)

100

Lead Standoff

Yes

Supplier Color

Pure Green/Super Red

Lead Shape

Through Hole

Supplier Package

T-1

PCB changed

2

Package Height

3.5(Max)

Mounting

Through Hole

High Brightness

No

High Power

No

Maximum Forward Current (mA)

75

Peak Wavelength (nm)

557/635

Dominant Wavelength (nm)

560/628

Mounting Orientation

Top Mount

Lens Appearance

Colorless Non Diffused

Lens Dimensions (mm)

3.1x3.1x2.35

Lens Shape Type

Circular

Category

Standard LED

PPAP

No

Automotive

No

ECCN (US)

EAR99

EU RoHS

Supplier Unconfirmed

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Type

Bi-Color

Color

Green/Red

Pin Count

a count of all of the component leads (or pins)

2

Luminous Flux

the measure of the perceived power of light.

0.1lm

Number of LEDs

2

Diameter

3.6(Max)