Infineon LG S269-BO

EU RoHS

Supplier Unconfirmed

ECCN (US)

EAR99

Automotive

No

PPAP

No

Category

Chip LED

LED Material

GaAsP

Lens Shape Type

Rectangular

Lens Appearance

Colored Diffused

Mounting Orientation

Top Mount

Intensity

0.18mcd

Dominant Wavelength (nm)

570

Peak Wavelength (nm)

572

Viewing Angle (°)

140

Maximum Forward Current (mA)

7.5

Test Current (mA)

2

Maximum Forward Voltage (V)

2.5

Reverse Voltage (V)

12

Minimum Operating Temperature (°C)

-55

Maximum Operating Temperature (°C)

100

Lead Standoff

No

Supplier Color

Green

High Power

No

High Brightness

No

Mounting

Surface Mount

Package Height

1(Max)

Package Width

1.4(Max)

Package Length

3(Max)

PCB changed

3

Standard Package Name

SOT

Supplier Package

SOT-23

Lead Shape

Gull-wing

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Type

Uni-Color

Color

Green

Pin Count

a count of all of the component leads (or pins)

3

Number of LEDs

1