Infineon ESD5V3S1B02LRHE6327XTMA1

Mounting

Surface Mount

Package Height

0.35(Max)

Package Width

0.6

Package Length

1

PCB changed

2

Maximum Operating Temperature (°C)

125

Minimum Operating Temperature (°C)

-55

Capacitance Value (pF)

20

Maximum Leakage Current (uA)

0.1

Maximum Clamping Voltage (V)

13

Maximum Working Voltage (V)

5.3

Number of Elements per Chip

1

Direction Type

Bi-Directional

PPAP

No

Automotive

No

HTS

8536.30.80.00

ECCN (US)

EAR99

EU RoHS

Compliant

Standard Package Name

TSLP

Supplier Package

TSLP

Lead Shape

No Lead

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Unconfirmed

Type

TVS

Pin Count

a count of all of the component leads (or pins)

2

Configuration

Single