ESD5V0S1U03WE6327XT

Infineon ESD5V0S1U03WE6327XT

Part No:

ESD5V0S1U03WE6327XT

Manufacturer:

Infineon

Datasheet:

Package:

-

AINNX NO:

31953777-ESD5V0S1U03WE6327XT

Description:

Products specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • HTS
    8536.30.80.00
  • Automotive
    No
  • PPAP
    No
  • Direction Type
    Uni-Directional
  • Number of Elements per Chip
    1
  • Maximum Working Voltage (V)
    5
  • Maximum Clamping Voltage (V)
    14
  • Lead Shape
    Gull-wing
  • Supplier Package
    SOD-323
  • Standard Package Name
    SOD
  • PCB changed
    2
  • Package Length
    1.7
  • Package Width
    1.25
  • Package Height
    1.05(Max)
  • Mounting
    Surface Mount
  • Maximum Operating Temperature (°C)
    125
  • Minimum Operating Temperature (°C)
    -55
  • Capacitance Value (pF)
    500
  • Peak Pulse Power Dissipation (W)
    600
  • Maximum Leakage Current (uA)
    20
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape and Reel
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Type
    TVS
  • Pin Count

    a count of all of the component leads (or pins)

    2
  • Configuration
    Single
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