Infineon BSM15GD100D

Package / Case

Axial

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

Supplier Device Package

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Number of Terminals

17

Transistor Element Material

SILICON

Manufacturer Part Number

BSM15GD100D

Manufacturer

Infineon

Package Description

FLANGE MOUNT, R-PUFM-D17

Package Style

FLANGE MOUNT

Package Body Material

PLASTIC/EPOXY

Turn-on Time-Nom (ton)

15 ns

Operating Temperature-Max

150 °C

Turn-on Time-Max (ton)

20 ns

Package Shape

RECTANGULAR

Number of Elements

6

Part Life Cycle Code

Transferred

Ihs Manufacturer

SIEMENS A G

Risk Rank

5.28

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-55°C ~ 155°C

Series

MBA/SMA 0204 - Professional

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Box (TB)

Size / Dimension

0.063 Dia x 0.142 L (1.60mm x 3.60mm)

Tolerance

±1%

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Number of Terminations

2

Temperature Coefficient

The resistance-change factor per degree Celsius of temperature change is called the temperature coefficient of resistance. This factor is represented by the Greek lower-case letter “alpha” (α). A positive coefficient for a material means that its resistance increases with an increase in temperature.

±50ppm/°C

Resistance

3.32 Ohms

Composition

Thin Film

Power (Watts)

0.4W

Subcategory

Insulated Gate BIP Transistors

Terminal Position

UPPER

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

SOLDER LUG

Reach Compliance Code

unknown

JESD-30 Code

R-PUFM-D17

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Failure Rate

the frequency with which an engineered system or component fails, expressed in failures per unit of time. It is usually denoted by the Greek letter λ (lambda) and is often used in reliability engineering.

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Configuration

BRIDGE, 6 ELEMENTS WITH BUILT-IN DIODE

Case Connection

ISOLATED

Transistor Application

POWER CONTROL

Polarity/Channel Type

N-CHANNEL

Power Dissipation-Max (Abs)

125 W

Collector Current-Max (IC)

15 A

Collector-Emitter Voltage-Max

1000 V

Gate-Emitter Voltage-Max

20 V

VCEsat-Max

3.3 V

Gate-Emitter Thr Voltage-Max

6.2 V

Power Dissipation Ambient-Max

150 W

Features

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Height Seated (Max)

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