Hamlin ZEN056V130A24GS

Mounting Type

Surface Mount

Package / Case

3-SMD, No Lead

Supplier Device Package

SMD

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Other Names

RF1730-000

Series

PolyZen

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Moisture Sensitivity Level (MSL)

2A (4 Weeks)

Applications

General Purpose

Technology

Mixed Technology

Number of Circuits

1

Voltage - Clamping

24V