SP725ABG

Hamlin SP725ABG

Part No:

SP725ABG

Manufacturer:

Hamlin

Datasheet:

-

Package:

8-SOIC (0.154, 3.90mm Width)

AINNX NO:

47456347-SP725ABG

Description:

Products specifications
  • Mounting Type
    Surface Mount
  • Package / Case
    8-SOIC (0.154, 3.90mm Width)
  • Supplier Device Package
    8-SOIC
  • Lead Free Status / RoHS Status
    Lead free / RoHS Compliant
  • Series
    -
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tube
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Applications
    General Purpose
  • Technology
    Mixed Technology
  • Number of Circuits
    4
  • Voltage - Clamping
    -
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