GD5F1GQ4RCYIG
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32780119-GD5F1GQ4RCYIG
1.8v 1Gb SPI NAND WSON8*6 package
having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.
Any Feature, including a modified Existing Feature, that is not an Existing Feature.
Occurring at or forming the end of a series, succession, or the like; closing; concluding.
The center distance from one pole to the next.
Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.
A phase of operation during the operation and maintenance stages of the life cycle of a facility.
A special high-voltage supply that supplies the potential and energy for altering the state of certain nonvolatile memory arrays. On some devices, the presence of VPP also acts as a program enable signal (P).