G3R20MT12N

GeneSiC Semiconductor G3R20MT12N

Part No:

G3R20MT12N

Datasheet:

-

Package:

QFN

AINNX NO:

36382255-G3R20MT12N

Description:

Silicon Carbide MOSFET,Single, N Channel, 105 A, 1.2 kV, 0.02 ohm, SOT-227

Products specifications
  • Package / Case
    QFN
  • Mounting Type
    Chassis Mount
  • Supplier Device Package
    SOT-227
  • Standard Frequency
    50
  • Operating Temp Range
    -40C to 85C
  • Operating Supply Voltage (Max)
    2.75(V)
  • Operating Supply Voltage (Min)
    2.25(V)
  • Programmable
    No
  • Continuous Drain Current Id
    105A
  • Package
    Tube
  • Base Product Number
    G3R20
  • Current - Continuous Drain (Id) @ 25℃
    105A (Tc)
  • Drive Voltage (Max Rds On, Min Rds On)
    15V
  • Mfr
    GeneSiC Semiconductor
  • Power Dissipation (Max)
    365W (Tc)
  • Product Status
    Active
  • Vds - Drain-Source Breakdown Voltage
    1.2 kV
  • Vgs th - Gate-Source Threshold Voltage
    2.7 V
  • Pd - Power Dissipation
    338 W
  • Transistor Polarity
    N-Channel
  • Maximum Operating Temperature

    the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    + 175 C
  • Vgs - Gate-Source Voltage
    - 5 V, + 15 V
  • Minimum Operating Temperature
    - 55 C
  • Mounting Styles
    SMD/SMT
  • Channel Mode
    Enhancement
  • Qg - Gate Charge
    180 nC
  • Rds On - Drain-Source Resistance
    20 mOhms
  • Id - Continuous Drain Current
    93 A
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -55°C ~ 175°C (TJ)
  • Series
    G3R™
  • Type
    CLOCK OSCILLATOR
  • Technology
    SiCFET (Silicon Carbide)
  • Frequency Stability

    the variation of output frequency of a crystal oscillator due to external conditions like temperature variation, voltage variation, output load variation, and frequency aging.

    ±50(ppm)
  • Symmetry-Max
    55(%)
  • Number of Channels
    1 Channel
  • Power Dissipation

    the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

    365W
  • FET Type
    N-Channel
  • Rds On (Max) @ Id, Vgs
    24mOhm @ 60A, 15V
  • Vgs(th) (Max) @ Id
    2.69V @ 15mA
  • Input Capacitance (Ciss) (Max) @ Vds
    5873 pF @ 800 V
  • Gate Charge (Qg) (Max) @ Vgs
    219 nC @ 15 V
  • Drain to Source Voltage (Vdss)
    1200 V
  • Vgs (Max)
    +20V, -10V
  • Channel Type
    N Channel
  • FET Feature
    -
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