FTDI DLP-FPGA

Body Material

Polyolefin

Product Thickness

0.64

Operating Temp Range

-55C to 135C

Shrink Wall Type

SINGLE

Inside Diameter After Shrinking

3.2

Inside Diameter Before Shrinking

6.4

Package

Bulk

Mfr

FTDI, Future Technology Devices International Ltd

Product Status

Active

Factory Pack QuantityFactory Pack Quantity

1

Manufacturer

FTDI

Brand

FTDI

RoHS

Details

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-

Series

FPGA

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Size / Dimension

-

Connector Type

USB - B, Pin Header

Type

TUBING

Color

Clear

Subcategory

Development Tools

Speed

-

RAM Size

128KB

Core Processor

Spartan-3E, XC3S250E

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

Interface Development Tools

Module/Board Type

FPGA Core

Flash Size

-

Co-Processor

-

Product Category

a particular group of related products.

Interface Development Tools

Shrink Ratio

2:1

Product Length (mm)

1200(mm)