FTDI DLP-245PB-G

Material

Aluminum

Shape

Square, Fins

Package Cooled

Assorted (BGA, LGA, CPU, ASIC...)

Material Finish

Blue Anodized

Package

Bulk

Base Product Number

DLP-245

Mfr

FTDI, Future Technology Devices International Ltd

Product Status

Active

Factory Pack QuantityFactory Pack Quantity

1

Manufacturer

FTDI

Brand

FTDI

RoHS

Details

Series

pushPIN™

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

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Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Size / Dimension

2.300 L x 0.700 W (58.40mm x 17.80mm)

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Connector Type

USB - B, Pin Header

Type

Top Mount

Subcategory

Development Tools

Attachment Method

Push Pin

Height Off Base (Height of Fin)

0.984 (25.00mm)

Thermal Resistance @ Forced Air Flow

4.11°C/W @ 100 LFM

Speed

-

RAM Size

368KB

Core Processor

PIC16F877A

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

Interface Development Tools

Flash Size

8KB

Thermal Resistance @ Natural

--

Power Dissipation @ Temperature Rise

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Co-Processor

-

Product Category

a particular group of related products.

Interface Development Tools

Width

1.575 (40.00mm)

Length

1.575 (40.00mm)

Diameter

--