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TEA1792TS/1Z

Freescale Semiconductor, Inc. (NXP Semiconductors) TEA1792TS/1Z

Part No:

TEA1792TS/1Z

Datasheet:

-

Package:

-

AINNX NO:

31799704-TEA1792TS/1Z

Description:

Products specifications
  • EU RoHS
    Compliant
  • Automotive
    No
  • PPAP
    No
  • Mounting
    Surface Mount
  • Package Height
    1(Max)
  • Package Width
    1.7(Max)
  • Package Length
    3.1(Max)
  • PCB changed
    6
  • Standard Package Name
    SOP
  • Supplier Package
    TSOP
  • Lead Shape
    Gull-wing
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape and Reel
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Pin Count

    a count of all of the component leads (or pins)

    6
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