Freescale Semiconductor, Inc. (NXP Semiconductors) TEA1731TS/1Z

EU RoHS

Compliant

ECCN (US)

EAR99

Automotive

No

PPAP

No

Minimum Supply Voltage (V)

-0.4

Maximum Supply Voltage (V)

35

Minimum Under Voltage Lock Out (V)

11.2

Typical Under Voltage Lock Out (V)

12.5

Maximum Under Voltage Lock Out (V)

13.8

Maximum Operating Current (mA)

0.58(Typ)

Switching Frequency (kHz)

89

Soft Start Option

Yes

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

150

Mounting

Surface Mount

Package Height

1(Max)

Package Width

1.7(Max)

Package Length

3.1(Max)

PCB changed

6

Standard Package Name

SOP

Supplier Package

TSOP

Lead Shape

Gull-wing

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Pin Count

a count of all of the component leads (or pins)

6

Topology

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