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MFRC63001HN,518

Freescale Semiconductor, Inc. (NXP Semiconductors) MFRC63001HN,518

Part No:

MFRC63001HN,518

Datasheet:

-

Package:

-

AINNX NO:

31976066-MFRC63001HN,518

Description:

Products specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    5A992
  • Automotive
    No
  • PPAP
    No
  • Mounting
    Surface Mount
  • Package Height
    0.95(Max)
  • Package Width
    5.1(Max)
  • Package Length
    5.1(Max)
  • PCB changed
    32
  • Supplier Package
    HVQFN EP
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape and Reel
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Unconfirmed
  • Pin Count

    a count of all of the component leads (or pins)

    32
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