CLRC63201T/0FE,118

Freescale Semiconductor, Inc. (NXP Semiconductors) CLRC63201T/0FE,118

Part No:

CLRC63201T/0FE,118

Datasheet:

-

Package:

-

AINNX NO:

31976078-CLRC63201T/0FE,118

Description:

Products specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • HTS
    8542330001
  • Automotive
    No
  • PPAP
    No
  • Module/IC Classification
    IC
  • Operation
    Read/Write
  • Covered Range (mm)
    100
  • Frequency Range (MHz)
    13.56(Typ)
  • Host Interface
    SPI
  • Maximum Operating Supply Voltage (V)
    3.6
  • Minimum Operating Temperature (°C)
    -25
  • Maximum Operating Temperature (°C)
    85
  • Mounting
    Surface Mount
  • Package Height
    2.45(Max)
  • Package Width
    7.6(Max)
  • Package Length
    20.7(Max)
  • PCB changed
    32
  • Standard Package Name
    SOP
  • Supplier Package
    SO
  • Lead Shape
    Gull-wing
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape and Reel
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Pin Count

    a count of all of the component leads (or pins)

    32
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