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74AHC1G32GW,115

Freescale Semiconductor, Inc. (NXP Semiconductors) 74AHC1G32GW,115

Part No:

74AHC1G32GW,115

Datasheet:

-

Package:

-

AINNX NO:

31956040-74AHC1G32GW,115

Description:

Products specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • SVHC
    Yes
  • Automotive
    No
  • PPAP
    No
  • Mounting
    Surface Mount
  • Package Height
    1(Max)
  • Package Width
    1.35(Max)
  • Package Length
    2.2(Max)
  • PCB changed
    5
  • Standard Package Name
    SOP
  • Supplier Package
    TSSOP
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape and Reel
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Pin Count

    a count of all of the component leads (or pins)

    5
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