Freescale Semiconductor, Inc. (NXP Semiconductors) HEF4069UBT-Q100J

EU RoHS

Compliant

ECCN (US)

EAR99

HTS

8542.39.00.01

Automotive

Yes

PPAP

Unknown

Logic Family

HEF4000

Number of Elements per Chip

6

Maximum Propagation Delay Time @ Maximum CL (ns)

90@5V|40@10V|25@15V

Absolute Propagation Delay Time (ns)

90

Process Technology

CMOS

Maximum Low Level Output Current (mA)

4.2(Min)

Maximum High Level Output Current (mA)

-4.2

Minimum Operating Supply Voltage (V)

3

Typical Operating Supply Voltage (V)

3.3|5|9|12

Maximum Operating Supply Voltage (V)

15

Maximum Quiescent Current (uA)

1

Propagation Delay Test Condition (pF)

50

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

125

Mounting

Surface Mount

Package Height

1.45(Max)

Package Width

4(Max)

Package Length

8.75(Max)

PCB changed

14

Supplier Package

SO

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Pin Count

a count of all of the component leads (or pins)

14

Logic Function

Inverter