Freescale Semiconductor MC54HC32AJ

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

Weight

no more than 110 g

Number of Terminals

14

Rohs Code

No

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MOTOROLA SEMICONDUCTOR PRODUCTS

Package Description

DIP, DIP14,.3

Load Capacitance (CL)

50 pF

Operating Temperature-Max

125 °C

Operating Temperature-Min

-55 °C

Package Body Material

CERAMIC

Package Code

DIP

Package Equivalence Code

DIP14,.3

Package Shape

RECTANGULAR

Package Style

IN-LINE

Gross Weight

116.20

Transport packaging size/quantity

28.5*21*19/160

Maximum output power

2.5 W

Additional

core size type ШI-10x17/ EI 30x17

JESD-609 Code

e0

Type

sealed power transformer for printed circuit mounting 220 V 50 Hz

Terminal Finish

Tin/Lead (Sn/Pb)

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

THROUGH-HOLE

Terminal Pitch

The center distance from one pole to the next.

2.54 mm

Depth

32 mm

Reach Compliance Code

unknown

JESD-30 Code

R-XDIP-T14

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Power Supplies

an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

2/6 V

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

MILITARY

Voltage

no-load operation - 18.9 V

Logic IC Type

OR GATE

Max I(ol)

0.0024 A

Prop. Delay@Nom-Sup

55 ns

Schmitt Trigger

NO

Load current

nominal - 0.18 A

Height

25.5 (body) mm

Width

27 mm