MC14069UBCP

Freescale Semiconductor MC14069UBCP

Part No:

MC14069UBCP

Package:

-

AINNX NO:

68720492-MC14069UBCP

Description:

IC,LOGIC GATE,HEX INVERTER,CMOS,DIP,14PIN,PLASTIC

Products specifications
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    NO
  • Number of Terminals
    14
  • Rohs Code
    No
  • Part Life Cycle Code
    Obsolete
  • Ihs Manufacturer
    MOTOROLA SEMICONDUCTOR PRODUCTS
  • Package Description
    DIP, DIP14,.3
  • Load Capacitance (CL)
    50 pF
  • Operating Temperature-Max
    125 °C
  • Operating Temperature-Min
    -55 °C
  • Package Body Material
    PLASTIC/EPOXY
  • Package Code
    DIP
  • Package Equivalence Code
    DIP14,.3
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE
  • JESD-609 Code
    e0
  • Type
    3-pin microphone jack for panel
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Terminal Position
    DUAL
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    THROUGH-HOLE
  • Terminal Pitch

    The center distance from one pole to the next.

    2.54 mm
  • Depth
    overall - 39 mm
  • Reach Compliance Code
    unknown
  • JESD-30 Code
    R-PDIP-T14
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Power Supplies

    an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

    5/15 V
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    MILITARY
  • Logic IC Type
    INVERTER
  • Max I(ol)
    0.0042 A
  • Prop. Delay@Nom-Sup
    125 ns
  • Schmitt Trigger
    NO
  • Features
    shielded design with push-pull mechanism
  • Height
    35.5 mm
  • Width
    26.2 mm
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