EPC B82143A1272K000

Number of Terminals

2

Core Material

Core materials are produced in a variety of forms including end-grain balsa wood, PVC foam, urethane foam, non-woven core fabrics, and various types of honeycomb materials.

Ferrite

EU RoHS

Compliant with Exemption

ECCN (US)

EAR99

Automotive

Unknown

PPAP

Unknown

Inductance (H)

2.7u

Inductance Test Frequency (Hz)

1M

Maximum DC Current (A)

1.5

Maximum Saturation Current (A)

1.5

Maximum DC Resistance (Ohm)

0.13

Minimum Quality Factor

50

Quality Test Frequency (Hz)

7.96M

Minimum Self Resonant Frequency (Hz)

125M

Mounting

Through Hole

Minimum Operating Temperature (°C)

-55

Maximum Operating Temperature (°C)

125

Product Diameter (mm)

4

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Tolerance

10%

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Type

RF Choke

Lead Style

Axial

Product Length (mm)

11.5