Darfon Elec C2012X7R225KFPS

Package / Case

0805

Number of Terminals

2

Operating Temp Range

-55C to 125C

Case Style

Ceramic Chip

Mounting Styles

Surface Mount

Product Depth (mm)

1.25(mm)

Rad Hardened

No

Lead Diameter (nom)

Not Required(mm)

Product Diameter (mm)

Not Required(mm)

Wire Form

Not Required

Temp Coeff (Dielectric)

X7R

Tolerance (+ or -)

10%

Microwave Application

NO

Seated Plane Height

Not Required(mm)

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Capacitance

2200000PF(pF)

Construction

SMT Chip

Termination Style

PAD

Failure Rate

the frequency with which an engineered system or component fails, expressed in failures per unit of time. It is usually denoted by the Greek letter λ (lambda) and is often used in reliability engineering.

Not Required

Voltage

25VDC

Product Length (mm)

2(mm)

Product Height (mm)

1.25(mm)