Darfon Elec C0603X5R103KETS

Package / Case

0201

Number of Terminals

2

Case Style

Ceramic Chip

Product Depth (mm)

0.3(mm)

Mounting Styles

Surface Mount

Rad Hardened

No

Lead Diameter (nom)

Not Required(mm)

Temp Coeff (Dielectric)

X5R

Product Diameter (mm)

Not Required(mm)

Operating Temp Range

-55C to 85C

Wire Form

Not Required

Microwave Application

NO

Tolerance (+ or -)

10%

Seated Plane Height

Not Required(mm)

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Capacitance

10000PF(pF)

Construction

SMT Chip

Termination Style

PAD

Failure Rate

the frequency with which an engineered system or component fails, expressed in failures per unit of time. It is usually denoted by the Greek letter λ (lambda) and is often used in reliability engineering.

Not Required

Voltage

16VDC

Product Length (mm)

0.6(mm)

Product Height (mm)

0.3(mm)