Cypress Semiconductor Corp CY8C3866AXI-039

Factory Lead Time

16 Weeks

Contact Plating

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

Gold

Mounting Type

Surface Mount

Package / Case

100-LQFP

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Pins

100

Data Converters

A/D 16x20b; D/A 4x8b

Number of I/Os

62

Watchdog Timers

Yes

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-40°C~85°C TA

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Series

PSOC® 3 CY8C38xx

Published

2011

JESD-609 Code

e4

Pbfree Code

yes

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Number of Terminations

100

ECCN Code

3A991.A.3

Terminal Position

QUAD

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Peak Reflow Temperature (Cel)

260

Supply Voltage

3.3V

Terminal Pitch

The center distance from one pole to the next.

0.5mm

Frequency

67MHz

Time@Peak Reflow Temperature-Max (s)

30

Base Part Number

CY8C3866

Pin Count

a count of all of the component leads (or pins)

100

Supply Voltage-Max (Vsup)

5.5V

Power Supplies

an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

2/5V

Supply Voltage-Min (Vsup)

1.71V

Interface

EBI/EMI, I2C, LIN, SPI, UART, USART, USB

Memory Size

The memory capacity is the amount of data a device can store at any given time in its memory.

64kB

Oscillator Type

Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

Internal

RAM Size

8K x 8

Voltage - Supply (Vcc/Vdd)

1.71V~5.5V

Core Processor

8051

Peripherals

CapSense, DMA, LCD, POR, PWM, WDT

Program Memory Type

Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

FLASH

Core Size

8-Bit

Program Memory Size

64KB 64K x 8

Connectivity

EBI/EMI, I2C, LINbus, SPI, UART/USART, USB

Data Bus Width

8b

Number of Timers/Counters

4

EEPROM Size

2K x 8

Boundary Scan

YES

Number of Programmable I/O

72

RAM (words)

8000

UV Erasable

N

ROM Size (bits)

65536Bits

Height Seated (Max)

1.6mm

REACH SVHC

No SVHC

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant

Lead Free

Lead Free