Cypress Semiconductor Corp CY8C21434-24LTXI

Factory Lead Time

13 Weeks

Contact Plating

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

Gold

Mounting Type

Surface Mount

Package / Case

32-WFQFN Exposed Pad

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Pins

32

Data Converters

A/D 28x8b

Number of I/Os

28

Watchdog Timers

Yes

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-40°C~85°C TA

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Series

PSOC®1 CY8C21xxx

Published

2003

JESD-609 Code

e4

Pbfree Code

yes

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Number of Terminations

32

ECCN Code

EAR99

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

ALSO OPERATES AT 3.3V SUPPLY

Terminal Position

QUAD

Supply Voltage

2.7V

Frequency

24MHz

Base Part Number

CY8C21434

Pin Count

a count of all of the component leads (or pins)

32

Supply Voltage-Max (Vsup)

5.25V

Supply Voltage-Min (Vsup)

2.4V

Interface

I2C, SPI, UART, USART

Memory Size

The memory capacity is the amount of data a device can store at any given time in its memory.

8kB

Oscillator Type

Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

Internal

RAM Size

512 x 8

Voltage - Supply (Vcc/Vdd)

2.4V~5.25V

uPs/uCs/Peripheral ICs Type

MULTIFUNCTION PERIPHERAL

Core Processor

M8C

Peripherals

POR, PWM, WDT

Program Memory Type

Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

FLASH

Core Size

8-Bit

Program Memory Size

8KB 8K x 8

Connectivity

I2C, SPI, UART/USART

Data Bus Width

8b

Number of Timers/Counters

1

Boundary Scan

NO

RAM (words)

512

Bus Compatibility

I2C; IRDA; SPI; UART; USB

Height

880μm

Length

5mm

Width

5mm

REACH SVHC

No SVHC

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant

Lead Free

Lead Free