5962-01-446-1391

Cypress Semiconductor 5962-01-446-1391

Part No:

5962-01-446-1391

Datasheet:

-

Package:

-

AINNX NO:

32723071-5962-01-446-1391

Description:

DIP, DIP24,.3

Products specifications
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    NO
  • Number of Terminals
    24
  • Manufacturer Part Number
    5962-01-446-1391
  • Part Life Cycle Code
    Obsolete
  • Ihs Manufacturer
    CYPRESS SEMICONDUCTOR CORP
  • Package Description
    DIP, DIP24,.3
  • Risk Rank
    5.84
  • Access Time-Max
    45 ns
  • Number of Words
    1024 words
  • Number of Words Code
    1000
  • Operating Temperature-Max
    125 °C
  • Operating Temperature-Min
    -55 °C
  • Package Body Material
    CERAMIC
  • Package Code
    DIP
  • Package Equivalence Code
    DIP24,.3
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE
  • Supply Voltage-Nom (Vsup)
    5 V
  • Usage Level
    Military grade
  • Terminal Position
    DUAL
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    THROUGH-HOLE
  • Terminal Pitch

    The center distance from one pole to the next.

    2.54 mm
  • Reach Compliance Code
    unknown
  • JESD-30 Code
    R-XDIP-T24
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Power Supplies

    an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

    5 V
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    MILITARY
  • Supply Current-Max
    0.12 mA
  • Organization
    1KX8
  • Memory Width
    8
  • Standby Current-Max
    0.12 A
  • Memory Density
    8192 bit
  • Screening Level
    38535Q/M;38534H;883B
  • Memory IC Type
    OTP ROM
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