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CUI Devices HSB26-343408
Part No:
HSB26-343408
Manufacturer:
Datasheet:
Package:
-
AINNX NO:
31072329-HSB26-343408
Category:
Description:
Heat Sinks heat sink, BGA, 33.5 x 33.5 x 8 mm
Products specifications
- MaterialAluminum Alloy
- ShapeSquare, Pin Fins
- Package CooledBGA
- Material FinishBlack Anodized
- RoHSDetails
- Designed forBGA
- Mounting StylesAdhesive
- Heatsink MaterialAluminum
- Fin StyleVertical Fin
- PackageBox
- MfrCUI Devices
- Product StatusActive
- SeriesHSB
- TypeBGA Heatsink
- ColorBlack
- Attachment MethodAdhesive
- Thermal Resistance @ Forced Air Flow5.30°C/W @ 200 LFM
- Thermal Resistance @ Natural15.19°C/W
- Power Dissipation @ Temperature Rise4.94W @ 75°C
- ProductHeatsinks
- Thermal Resistance
Thermal resistance is defined as the ratio of the temperature difference between the two faces of a material to the rate of heat flow per unit area. Thermal resistance determines the heat insulation property of a textile material. The higher the thermal resistance, the lower is the heat loss.
17.9 C/W - Length33.5 mm
- Width33.5 mm
- Height8 mm
- Diameter-
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