All Products
CUI Devices HSB25-282810
Part No:
HSB25-282810
Manufacturer:
Datasheet:
Package:
-
AINNX NO:
31072336-HSB25-282810
Category:
Description:
Heat Sinks heat sink, BGA, 28.5 x 28.5 x 10 mm, mounting holes
Products specifications
- MaterialAluminum Alloy
- ShapeSquare, Pin Fins
- Package CooledBGA
- Material FinishBlack Anodized
- RoHSDetails
- Designed forBGA
- Mounting StylesAdhesive
- Heatsink MaterialAluminum
- Fin StyleVertical Fin
- PackageBox
- MfrCUI Devices
- Product StatusActive
- SeriesHSB
- TypeBGA Heatsink
- ColorBlack
- Attachment MethodPush Pin
- Thermal Resistance @ Forced Air Flow5.10°C/W @ 200 LFM
- Thermal Resistance @ Natural15.41°C/W
- Power Dissipation @ Temperature Rise4.87W @ 75°C
- ProductHeatsinks
- Thermal Resistance
Thermal resistance is defined as the ratio of the temperature difference between the two faces of a material to the rate of heat flow per unit area. Thermal resistance determines the heat insulation property of a textile material. The higher the thermal resistance, the lower is the heat loss.
18.2 C/W - Length28.5 mm
- Width28.5 mm
- Height10 mm
- Diameter-
0 Similar Products Remaining
Hot Sale
HSE-B20254-035H
CUI DevicesHEAT SINK, EXTRUSION, TO-220,25.
HSS-B20-095H
CUI DevicesHEATSINK TO-220 4.1W ALUMINUM
HSE-B18317-035H-01
CUI DevicesHEAT SINK, EXTRUSION, TO-218, 31
HSE-B20254-035H-01
CUI DevicesHEAT SINK, EXTRUSION, TO-220, 25HSS20-B20-NP
CUI DevicesHeat Sinks heat sink, stamping, TO-218/TO-220, 19 x 22 x 11 mm, no pinHSE05-171933
CUI DevicesHeat Sinks heat sink, extrusion, TO-218/TO-220, 17 x 19.4 x 32.5 mmHSB26-343408
CUI DevicesHeat Sinks heat sink, BGA, 33.5 x 33.5 x 8 mmHSE07-753045
CUI DevicesHeat Sinks heat sink, extrusion, TO-218/TO-220, 75 x 30 x 45 mmHSB25-282810
CUI DevicesHeat Sinks heat sink, BGA, 28.5 x 28.5 x 10 mm, mounting holesHSB24-252510
CUI DevicesHeat Sinks heat sink, BGA,25 x 25 x 10 mm