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CUI Devices HSB24-252510
Part No:
HSB24-252510
Manufacturer:
Datasheet:
Package:
-
AINNX NO:
31072337-HSB24-252510
Category:
Description:
Heat Sinks heat sink, BGA,25 x 25 x 10 mm
Products specifications
- MaterialAluminum Alloy
- ShapeSquare, Pin Fins
- Package CooledBGA
- Material FinishBlack Anodized
- RoHSDetails
- Designed forBGA
- Mounting StylesAdhesive
- Heatsink MaterialAluminum
- Fin StyleVertical Fin
- PackageBox
- MfrCUI Devices
- Product StatusActive
- SeriesHSB
- TypeBGA Heatsink
- ColorBlack
- Attachment MethodAdhesive
- Thermal Resistance @ Forced Air Flow6.50°C/W @ 200 LFM
- Thermal Resistance @ Natural18.10°C/W
- Power Dissipation @ Temperature Rise4.14W @ 75°C
- ProductHeatsinks
- Thermal Resistance
Thermal resistance is defined as the ratio of the temperature difference between the two faces of a material to the rate of heat flow per unit area. Thermal resistance determines the heat insulation property of a textile material. The higher the thermal resistance, the lower is the heat loss.
21.3 C/W - Length25 mm
- Width25 mm
- Height10 mm
- Diameter-
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