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CUI Devices HSB23-232325
Part No:
HSB23-232325
Manufacturer:
Datasheet:
Package:
-
AINNX NO:
31072353-HSB23-232325
Category:
Description:
Heat Sinks heat sink, BGA, 23 x 23 x 25 mm
Products specifications
- MaterialAluminum Alloy
- ShapeSquare, Pin Fins
- Package CooledBGA
- Material FinishBlack Anodized
- RoHSDetails
- Designed forBGA
- Mounting StylesAdhesive
- Heatsink MaterialAluminum
- Fin StyleVertical Fin
- PackageBox
- MfrCUI Devices
- Product StatusActive
- SeriesHSB
- TypeBGA Heatsink
- ColorBlack
- Attachment MethodAdhesive
- Thermal Resistance @ Forced Air Flow3.80°C/W @ 200 LFM
- Thermal Resistance @ Natural12.23°C/W
- Power Dissipation @ Temperature Rise6.13W @ 75°C
- ProductHeatsinks
- Thermal Resistance
Thermal resistance is defined as the ratio of the temperature difference between the two faces of a material to the rate of heat flow per unit area. Thermal resistance determines the heat insulation property of a textile material. The higher the thermal resistance, the lower is the heat loss.
16.1 C/W - Length23 mm
- Width23 mm
- Height25 mm
- Diameter-
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