All Products
CUI Devices HSB20-353525
HSB20-353525
-
50266426-HSB20-353525
HEAT SINK, BGA, 35 X 35 X 25 MM
- MaterialAluminum Alloy
- ShapeSquare, Pin Fins
- Package CooledBGA
- Material FinishBlack Anodized
- PackageBox
- MfrCUI Devices
- Product StatusActive
- Mounting StylesAdhesive
- Heatsink MaterialAluminum Alloy
- Designed forBGA
- Fin StyleVertical Fin
- SeriesHSB
- TypeTop Mount
- Attachment MethodAdhesive
- Thermal Resistance @ Forced Air Flow2.70°C/W @ 200 LFM
- Thermal Resistance @ Natural6.65°C/W
- Power Dissipation @ Temperature Rise11.3W @ 75°C
- ProductHeat Sinks
- Thermal Resistance
Thermal resistance is defined as the ratio of the temperature difference between the two faces of a material to the rate of heat flow per unit area. Thermal resistance determines the heat insulation property of a textile material. The higher the thermal resistance, the lower is the heat loss.
9.9 C/W - Width1.378 (35.00mm)
- Length1.378 (35.00mm)
- Diameter-
- Height25 mm
Quantity
Unit Price
Ext. Price
1+
$165.054435
$165.02
10+
$155.711767
$1,557.09
100+
$146.897885
$14,689.78
500+
$138.582861
$69,291.47
1000+
$130.738534
$130,738.58
* The above prices does not include taxes and freight rates, which will be calculated on the order pages.
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