HSB06-181810

CUI Devices HSB06-181810

Part No:

HSB06-181810

Manufacturer:

CUI Devices

Datasheet:

-

Package:

-

AINNX NO:

30985578-HSB06-181810

Description:

Heat Sinks heat sink, BGA, 18 x 18 x 10 mm

Products specifications
  • Material
    Aluminum Alloy
  • Shape
    Square, Pin Fins
  • Package Cooled
    BGA
  • Material Finish
    Black Anodized
  • Designed for
    BGA
  • Mounting Styles
    Adhesive
  • Heatsink Material
    Aluminum Alloy
  • Fin Style
    Vertical Fin
  • Factory Pack QuantityFactory Pack Quantity
    1960
  • Package
    Box
  • Mfr
    CUI Devices
  • Product Status
    Active
  • Series
    HSB
  • Type
    Top Mount
  • Color
    Black
  • Attachment Method
    Adhesive
  • Thermal Resistance @ Forced Air Flow
    18.80°C/W @ 200 LFM
  • Thermal Resistance @ Natural
    23.68°C/W
  • Power Dissipation @ Temperature Rise
    3.2W @ 75°C
  • Product
    Heatsinks
  • Thermal Resistance

    Thermal resistance is defined as the ratio of the temperature difference between the two faces of a material to the rate of heat flow per unit area. Thermal resistance determines the heat insulation property of a textile material. The higher the thermal resistance, the lower is the heat loss.

    29.1 C/W
  • Length
    18 mm
  • Width
    18 mm
  • Height
    10 mm
  • Diameter
    -
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