CML Innovative Technologies PSA08-12EWA

EU RoHS

Compliant

ECCN (US)

EAR99

Automotive

No

PPAP

No

Digit Size (in)

0.8

Character Displayed

Alphanumeric

Intensity (ucd)

7700

Dominant Wavelength (nm)

625

Peak Wavelength (nm)

627

Maximum Forward Current (mA)

30

Maximum Reverse Current (uA)

10

Test Current (mA)

10

Maximum Reverse Voltage (V)

5

Maximum Forward Voltage (V)

2.5

Maximum Power Dissipation (mW)

75

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Mounting

Through Hole

Package Height

8.5

Package Width

20

Package Length

27.7

PCB changed

18

Supplier Package

DIP Module

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tube

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

Module

Color

Hi-Eff. Red

Pin Count

a count of all of the component leads (or pins)

18

Configuration

Common Anode

Number of LEDs

16