CML Innovative Technologies DC04-11CGKWA

EU RoHS

Compliant

ECCN (US)

EAR99

Automotive

No

PPAP

No

Digit Size (in)

0.4

Character Displayed

Numeric

Intensity (ucd)

25000

Dominant Wavelength (nm)

570

Peak Wavelength (nm)

574

Maximum Forward Current (mA)

30

Maximum Reverse Current (uA)

10

Test Current (mA)

10

Maximum Reverse Voltage (V)

5

Maximum Forward Voltage (V)

2.5

Maximum Power Dissipation (mW)

75

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Mounting

Through Hole

Package Height

7

Package Width

16

Package Length

20.2

PCB changed

16

Supplier Package

DIP Module

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tube

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

Panel

Color

Green

Pin Count

a count of all of the component leads (or pins)

16

Configuration

Common Cathode

Number of LEDs

14