Bulgin BEA01SBY1

Factory Lead Time

20 Weeks

Material

Plastic, ABS

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

BE

Published

2013

Size / Dimension

3.157Lx2.866W 80.20mmx72.80mm

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Color

Black, Yellow Cover/Door

Depth

24.5mm

Design

Cover Included

Container Type

Box

Area (L x W)

9.05in2 (58.4cm2)

Features

Knockouts, PCB Supports

Height

2.087 53.00mm

Material Flammability Rating

UL94 HB

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant

Flammability Rating

UL94 HB

Ratings

IP67