Bulgin BEP01SGG0

Factory Lead Time

14 Weeks

Material

Plastic, Polycarbonate

Body Material

Polycarbonate

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

BE

Published

2008

Size / Dimension

3.157Lx2.866W 80.20mmx72.80mm

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Color

Gray

Depth

24.5mm

Design

Cover Included

Container Type

Box

Area (L x W)

9.05in2 (58.4cm2)

Features

Knockouts, PCB Supports

Height

2.087 53.00mm

Material Flammability Rating

UL94 V-0

REACH SVHC

No SVHC

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant

Flammability Rating

UL94 V-0

Ratings

IP67