BOPLA 35370003

Package / Case

QFN

Material

TPE (low-odour thermoplastic elastomer )

Product Depth (mm)

5(mm)

Operating Temp Range

-40C to 85C

Mounting Styles

Surface Mount

Dim

(L x W x H) 171 x 96 x 44.3 mm

RoHS-compliant

Yes

Content

1pc(s)

Factory colour

Signal yellow

Dimensions

171 x 96 x 44.3mm

For Use With

BoPad 700 Enclosures

Package

Bag

Mfr

Bopla Enclosures

Product Status

Active

For Use With/Related Products

Enclosures

Usage Level

Industrial grade

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

BoLink

Type

BOP 700 S Bopad Stoss-Schutz - 1003

Pin Count

a count of all of the component leads (or pins)

4

Accessory Type

Protective Sleeve

Screening Level

INDUSTRIALC

Product Length (mm)

7(mm)

Width

96mm

Height

44.3mm

Length

171mm

Product Height (mm)

0.9(mm)