BOPLA 35310105

Package / Case

QFN

Material

TPE (low-odour thermoplastic elastomer )

Product Depth (mm)

2.5(mm)

Operating Temp Range

-40C to 85C

Mounting Styles

Surface Mount

Dim

(L x W x H) 291 x 204 x 54.3 mm

Content

1pc(s)

Factory colour

Black

Dimensions

291 x 204 x 54.3mm

For Use With

BoPad 10.1 Enclosures

Package

Bag

Mfr

Bopla Enclosures

Product Status

Active

For Use With/Related Products

Enclosures

Usage Level

Industrial grade

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

BoLink

Type

BOP 10.1 S Bopad Stoss-Schutz - 9005

Pin Count

a count of all of the component leads (or pins)

4

Accessory Type

Protective Sleeve

Screening Level

Industrial

Product Length (mm)

2(mm)

Width

204mm

Height

54.3mm

Length

291mm

Product Height (mm)

0.75(mm)