M2S050-FGG484

Atmel (Microchip Technology) M2S050-FGG484

Part No:

M2S050-FGG484

Datasheet:

-

Package:

BGA-484

AINNX NO:

31109786-M2S050-FGG484

Description:

SoC FPGA M2S050-FGG484

Products specifications
  • Package / Case
    BGA-484
  • Shipping Restrictions
    This product may require additional documentation to export from the United States.
  • RoHS
    Details
  • Mounting Styles
    SMD/SMT
  • Maximum Clock Frequency
    166 MHz
  • L1 Cache Instruction Memory
    -
  • L1 Cache Data Memory
    -
  • Data RAM Size
    64 kB
  • Number of Logic Elements
    56340 LE
  • Number of I/Os
    267 I/O
  • Minimum Operating Temperature
    0 C
  • Maximum Operating Temperature

    the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    + 85 C
  • Distributed RAM
    1.314 Mbit
  • Embedded Block RAM - EBR
    64 kB
  • Moisture Sensitive
    Yes
  • Number of Logic Array Blocks - LABs
    4695 LAB
  • Factory Pack QuantityFactory Pack Quantity
    60
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Series
    SmartFusion2
  • Operating Supply Voltage

    The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

    1.2 V
  • Program Memory Size
    256 kB
  • Number of Cores
    1 Core
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