A2F200M3F-FGG256I

Atmel (Microchip Technology) A2F200M3F-FGG256I

Part No:

A2F200M3F-FGG256I

Datasheet:

-

Package:

FPBGA-256

AINNX NO:

31101343-A2F200M3F-FGG256I

Description:

SoC FPGA A2F200M3F-FGG256I

Products specifications
  • Package / Case
    FPBGA-256
  • RoHS
    Details
  • Mounting Styles
    SMD/SMT
  • Maximum Clock Frequency
    80 MHz
  • L1 Cache Instruction Memory
    -
  • L1 Cache Data Memory
    -
  • Data RAM Size
    64 kB
  • Number of Logic Elements
    2000 LE
  • Number of I/Os
    117 I/O
  • Minimum Operating Temperature
    - 40 C
  • Maximum Operating Temperature

    the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    + 100 C
  • Moisture Sensitive
    Yes
  • Number of Logic Array Blocks - LABs
    -
  • Factory Pack QuantityFactory Pack Quantity
    90
  • Tradename
    SmartFusion
  • Unit Weight
    0.690329 oz
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Series
    A2F200
  • Operating Supply Voltage

    The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

    1.5 V
  • Operating Supply Current
    7 mA
  • Program Memory Size
    256 kB
  • Number of Gates

    The number of gates per IC varies depending on the number of inputs per gate. Two?input gates are common, but if only a single input is required, such as in the 744 NOT(or inverter) gates, a 14 pin IC can accommodate 6 (or Hex) gates.

    200000
  • Number of Cores
    1 Core
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