Apex Microtechnology MS05

Factory Lead Time

10 Weeks

Mounting Type

Through Hole

Mount

Through Hole

Number of Pins

12

Housing Material

Polyester, Glass Filled

Number of Positions or Pins (Grid)

12 (2 x 6)

Contact Material - Mating

Beryllium Copper

Contact Material - Post

Brass

Contact Finish Mating

Gold

Series

Apex Precision Power®

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Termination

Solder

ECCN Code

EAR99

Type

DIP, 1.2 (30.48mm) Row Spacing

HTS Code

HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

8536.69.40.40

Pitch - Mating

0.100 2.54mm

Contact Finish - Post

Tin

Termination Post Length

0.270 6.86mm

Pitch - Post

0.100 2.54mm

Features

Open Frame

Contact Finish Thickness - Mating

30.0μin 0.76μm

Contact Finish Thickness - Post

200.0μin 5.08μm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant

Material Flammability Rating

UL94 V-0