Apex Microtechnology MS03

Factory Lead Time

10 Weeks

Mount

Through Hole

Mounting Type

Through Hole

Package / Case

TO-3

Number of Pins

8

Housing Material

Polyester, Glass Filled

Number of Positions or Pins (Grid)

8 (Oval)

Contact Material - Mating

Beryllium Copper

Contact Material - Post

Brass

Contact Finish Mating

Gold

Contact Materials

Copper

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

Apex Precision Power®

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Termination

Solder

ECCN Code

EAR99

Type

Transistor, TO-3

Contact Finish - Post

Tin

Termination Post Length

0.270 6.86mm

Features

Closed Frame

Contact Finish Thickness - Mating

30.0μin 0.76μm

Contact Finish Thickness - Post

200.0μin 5.08μm

Material Flammability Rating

UL94 V-0

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

Non-RoHS Compliant