Analog Devices, Inc. ADSP-CM417F-SWZENG

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

176

EU RoHS

Compliant

ECCN (US)

3A991.a.2

Automotive

No

PPAP

No

Family Name

ADSP-CM41xF

Maximum Clock Rate (MHz)

240

Data Bus Width (bit)

32

Processing Unit

Microprocessor

Watchdog

1

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

105

Interface Type

CAN/I2C/SPI/UART

I2C

1

I2S

0

UART

4

USART

0

PCI

0

Programmability

Yes

Mounting

Surface Mount

Package Height

1.4

Package Width

24

Package Length

24

PCB changed

176

Standard Package Name

QFP

Supplier Package

LQFP EP

Lead Shape

Gull-wing

Package Description

HLFQFP,

Package Style

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Manufacturer Package Code

SW-176-4

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

3.3 V

Operating Temperature-Max

105 °C

Rohs Code

Yes

Manufacturer Part Number

ADSP-CM417F-SWZENG

Clock Frequency-Max

60 MHz

Package Code

HLFQFP

Package Shape

SQUARE

Manufacturer

Analog Devices Inc

Part Life Cycle Code

Obsolete

Ihs Manufacturer

ANALOG DEVICES INC

Risk Rank

5.84

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Pbfree Code

No

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Type

Applications Processor

Technology

CMOS

Terminal Position

QUAD

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Terminal Pitch

The center distance from one pole to the next.

0.5 mm

Reach Compliance Code

compliant

Pin Count

a count of all of the component leads (or pins)

176

JESD-30 Code

S-PQFP-G176

Brand Name

Analog Devices Inc

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

INDUSTRIAL

Speed

240 MHz

RAM Size

160KB

uPs/uCs/Peripheral ICs Type

MICROPROCESSOR, RISC

Program Memory Type

Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

Flash

Program Memory Size

1MB

Seated Height-Max

1.6 mm

Core Architecture

ARM

Boundary Scan

YES

Low Power Mode

YES

Format

FLOATING POINT

Integrated Cache

NO

Ethernet

0

USB

0

SPI

1

PWM

1

Device Core

Used in casting and moulding processes to produce internal cavities and reentrant angles (an interior angle that is greater than 18°).

ARM Cortex M4

Width

24 mm

Length

24 mm