Analog Devices, Inc. ADSP-CM408BSWZ-BF

EU RoHS

Compliant

ECCN (US)

3A991.a.2

Automotive

No

PPAP

No

Maximum Clock Rate (MHz)

240

Data Bus Width (bit)

32

Processing Unit

Microprocessor

Watchdog

1

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

105

Interface Type

CAN/SPI/UART/USB

UART

3

Instruction Cache Size

16KB

Programmability

Yes

Mounting

Surface Mount

Package Height

1.4

Package Width

24

Package Length

24

PCB changed

176

Standard Package Name

QFP

Supplier Package

LQFP EP

Lead Shape

Gull-wing

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Type

Applications Processor

Pin Count

a count of all of the component leads (or pins)

176

RAM Size

384KB

Program Memory Type

Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

Flash

Program Memory Size

2MB

Core Architecture

ARM

USB

1

SPI

2

PWM

1

Device Core

Used in casting and moulding processes to produce internal cavities and reentrant angles (an interior angle that is greater than 18°).

ARM Cortex M4