XQ7Z030-1RF900I

AMD Xilinx XQ7Z030-1RF900I

Part No:

XQ7Z030-1RF900I

Manufacturer:

AMD Xilinx

Datasheet:

Package:

-

AINNX NO:

69162565-XQ7Z030-1RF900I

Description:

Microprocessor Circuit, CMOS, PBGA900, 31 X 31 MM, 1 MM PITCH, BGA-900

Products specifications
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Terminals
    900
  • Rohs Code
    No
  • Part Life Cycle Code
    Transferred
  • Ihs Manufacturer
    XILINX INC
  • Package Description
    31 X 31 MM, 1 MM PITCH, BGA-900
  • Package Body Material
    PLASTIC/EPOXY
  • Package Code
    BGA
  • Package Equivalence Code
    BGA900,30X30,40
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY
  • JESD-609 Code
    e0
  • Terminal Finish
    TIN LEAD
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.31.00.01
  • Terminal Position
    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BALL
  • Terminal Pitch

    The center distance from one pole to the next.

    1 mm
  • Reach Compliance Code
    not_compliant
  • JESD-30 Code
    S-PBGA-B900
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • uPs/uCs/Peripheral ICs Type
    PROGRAMMABLE SoC
  • Seated Height-Max
    3.44 mm
  • Length
    31 mm
  • Width
    31 mm
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